Webcorporate.ppg.com WebThough at the laboratory pad cratering is commonly detected after shock and other mechanical stress test failure may also be ascribed to …
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WebPad Cratering. Developed by the SMT Attachment Reliability Test Methods Task . Group (6-10d) of the Product Reliability Committee (6-10) of IPC ... Printed Board Assembly Pad Cratering 1 SCOPE This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to ... Web• Pad cratering test (pre-packaged) Wire pull / ball shear is performed after stress testing and decapsulation. A recommended process flow is described below: 1. Select components per the sample size specified in AEC-Q100/Q101 for wire pull and shear. Selecting worst-case components based on CSAM is desirable. 2. kraft creamy italian dressing with olive oil
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WebThe wire pull test is used to measure the strength and failure mode of the wire bond. Generally, if the hook is placed at the mid span of the wire, then the test will show the … Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a … See more Pad cratering most often occurs during dynamic mechanical events such as mechanical shock or board flexure due to In-circuit test (ICT), board depaneling, or connector insertion. However, pad cratering has also … See more There are several mitigation techniques that can used to reduce the risk of pad cratering. The appropriate method(s) is often driven by design and resource constraints. See more Additional information on pad cratering in printed circuit boards can be found in the following links: • See more IPC-9708 provides three test methods to characterize the pad cratering of a component and PCBA: pin pull, ball pull, and ball shear … See more Pad cratering can be difficult to detect during functional testing. This is especially the case with small or partial cracking that can escape testing … See more • BGA pad and solder ball exhibiting pad cratering. • Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and the pad has started to lift, eventually creating pad cratering. • Pad crater left on printed circuit board after copper pad from a … See more WebCratering is a general term used to describe one type of bonding failure that occurs as the result of mechanical damage to the bond pad or underlying material. This failure occurs on the underside of a wire bond during bond pull or shear test. Cratering occurs as a result of cracks generated under the bond pad during bonding. map bassin d\\u0027arcachon